Our facility has two dedicated tools for high quality and reproducible dry etching. RIE modules deliver anisotropic dry etching for an extensive range of processes. It offers a 200mm platform for excellent uniformity, high throughput, and high precision processes. An inductively coupled plasma (ICP) source produces a high density of reactive species at low pressure. One tool is dedicated for Fluorine based etching and other system offers Chlorine based etching. For more details click the link below.

      ICP-RIE etcher (F)

      ICP-RIE etcher (Cl)

 

 


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