EVG 610 Mask Aligner

The EVG 610 is a semi-automated system that can handle small substrate pieces and wafers up to 200 mm. The tool supports lithography processes, such as vacuum-, soft-, hard- and proximity exposure mode, as well as other specific applications, including bond alignment, nano imprint lithography (NIL) and micro contact printing.




  • Supports back side lithography and bond alignment processes when configured with bottom side microscopes
  • Sub-micron exposure gap repeatability in proximity exposure mode
  • Unmatched exposure light uniformity at wafer level, down to ± 1.5% for small substrate applications
  • Windows based user interface


User Support and  Scientific Advice


Responsible: Jack Merrin   jack.merrin@remove-this.ist.ac.at

Substitute: Lubuna Shafeek  lubuna.shafeek@remove-this.ist.ac.at 



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